Electronics Forum | Fri May 17 11:10:25 EDT 2002 | wister
Is there any software to design the stencil openings? It may be including automatic modify the aperture,monitoring aspect ratio and area ratio,even let you know the whole vloume of the opening and average ratio?because the stencil design is more impo
Electronics Forum | Mon Jul 18 10:55:26 EDT 2005 | Sylvain
I have a SO-8 mosfet part from Vishay SI7846DP-T1. Am having a lot of solder ball that coming underneath the part. Am currently using a 5 mils with a window design for my stencil. Those anyone have experience or have any suggestion for an aperture th
Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F
Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even
Electronics Forum | Fri Dec 06 13:00:29 EST 2002 | daanterstegge
I wouldn't recommend a metal squeegee, because if you can't wipe the step-etched area completely clean (that's the problem with metal) you'll have problems with the definition of the fine-pitch (it may stick in the holes). Best is a 70 Shore polyuret
Electronics Forum | Thu Apr 22 10:43:25 EDT 2004 | tigerlordgm
We had a great deal of trouble cleaning adhesive residue from stencils using an alcohol stencil washer. Same kind of thing, adhesive build-up in aperture corners. The solution we came up with was to convert our stencil washer to run Zestron ES200, a
Electronics Forum | Mon Apr 09 13:53:45 EDT 2018 | dleeper
I've never placed one of these before, but it looks like a poorly designed part. It has pads scattered asymmetrically around the body of the part. when it reflows this is going to apply uneven forces to the component, causing it to skew. I guess hav
Electronics Forum | Fri Feb 07 20:41:52 EST 2020 | orbitcoms
I am finding if I have to stop the pick and place machine during production very often (mostly due to feeders not pulling the tape cover back), I get paste drying in the apertures of the stencil. To avoid this I am thinking of pasting all the boards
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
Electronics Forum | Sat Feb 08 04:37:19 EST 2020 | spoiltforchoice
I work with small batches and this is what I do. However I don't do it because of the paste. Instead I do it because I am the sole operator on the line and I want one process finished so I can keep a better eye on the others. I specifically work with
